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White Dove Abrasives Co., Ltd., formerly known as the Second Abrasive Wheel Factory of China, was founded in 1956, and is one of the 156 key construction projects during the First Five-Year Plan period of the country.
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The products are widely used in industries such as automotive, hardware, steel, bearings, metals, wooden board and gear, etc.
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The main products of WhiteDove include bonded abrasives, coated abrasives, superabrasives and new abrasive materials, covering 8 categories, 17 series and more than 400 varieties, which are widely used in aerospace...
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Thinning or back grinding wheel for silicon wafer and sapphire wafer (Special purpose wheels)
500#, 2000# and 8000# grinding wheels are widely used in silicon carbide and sapphire substrate processing.
Keyword：
Thinning or back grinding wheel for silicon wafer and sapphire wafer (Special purpose wheels)
Category：
- Details
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- Commodity name: Thinning or back grinding wheel for silicon wafer and sapphire wafer (Special purpose wheels)
- Commodity ID: c1-007
500#, 2000# and 8000# grinding wheels are widely used in silicon carbide and sapphire substrate processing.
Industry fields
Solar ; semiconductor
Product introduction
High-efficiency, high-precision diamond abrasive tools for silicon carbide and sapphire substrate thinning processing, supporting various domestic and foreign special grinding machines for thinning processing.
A series of diamond grinding wheels for grinding monocrystalline silicon, polycrystalline silicon ingots and silicon rods in the photovoltaic industry.
Performance characteristics
It has the characteristics of sharp grinding wheel, high grinding efficiency, good surface quality of grinding workpiece, high durability and high cost performance.
Application scope
500#, 2000# and 8000# grinding wheels are widely used in silicon carbide and sapphire substrate processing.
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Website: www.whitedove.com.cn
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